Semiconductor device manufacturing: process – Repair or restoration
Patent
1997-10-21
1999-10-26
Niebling, John F.
Semiconductor device manufacturing: process
Repair or restoration
438 15, 438 17, 438 18, H01L 2100
Patent
active
059727233
ABSTRACT:
A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.
REFERENCES:
patent: 4261800 (1981-04-01), Beckenbaugh et al.
patent: 4624749 (1986-11-01), Black et al.
patent: 4919971 (1990-04-01), Chen
patent: 4931353 (1990-06-01), Tanielian
patent: 4994154 (1991-02-01), Chen et al.
patent: 5141602 (1992-08-01), Chen et al.
patent: 5144747 (1992-09-01), Eichelberger
patent: 5145714 (1992-09-01), Reisman et al.
patent: 5182230 (1993-01-01), Donelon et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5368711 (1994-11-01), Poris
patent: 5530372 (1996-06-01), Lee et al.
patent: 5568682 (1996-10-01), Gates, Jr. et al.
patent: 5747095 (1998-05-01), McAllister et al.
patent: 5818239 (1998-10-01), Scaman
S. Mutnick, "Repairing Breaks in Printed Circuits", IBM Technical Disclosure Bulletin, vol. 8, No. 11, Apr. 1966.
"Laser Deposition of Metal Films With Organo-Metal Ink", IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1988, pp. 45-46.
"Localized Laser Deposition of Gold From Solid Salts", Research Disclosure, Kenneth Mason Publications Ltd., England, No. 293, Sep. 1988.
F.M. Tappen, "Open Conductor Repair For Glass Metal Module", IBM Technical Disclosure Bulletin, vol. 14, No. 10, Mar. 1972, p. 2915.
"Method for Repairing Defective Electrical Connections on Multi-Layer Thin Film (MLTF) Electronic Packages and the Resulting MLTF Structure," is the subject of U.S. Patent Application Serial 08/577,677, filed on Dec. 21, 1995.
Bartley Gerald K.
Franklin Peter A.
Mele Carmine J.
Merryman Arthur G.
Pennacchia John R.
International Business Machines - Corporation
Murphy John
Niebling John F.
Townsend Tiffany L.
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