Enhanced thermo-oxidative stability thermal interface...

Solid anti-friction devices – materials therefor – lubricant or se – Lubricants or separants for moving solid surfaces and... – Organic phosphorus compound – wherein the phosphorus is...

Reexamination Certificate

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C508S442000, C508S478000, C508S563000, C508S585000, C508S591000

Reexamination Certificate

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07964542

ABSTRACT:
Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

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