Enhanced thermal transfer package for a semiconductor device

Details Enhanced thermal transfer package for a semiconductor device Enhanced thermal transfer package for a semiconductor device

1979-03-02

1981-05-26

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 80, 357 68, 174 16HS, H01L 2302, H01L 3902, H01L 2380

Patent

active

042701384

ABSTRACT:
A semiconductor device for flush mounting to an external heatsink includes an integral encapsulating body and an internal heatsink having a surface for heat transfer to an external heatsink. The encapsulating body encloses a semiconductor element and a portion of the internal heatsink but has a lower surface which when mounted to the external heatsink, lies above the surface thereof thereby insuring that flush mounting can be consistently achieved.

REFERENCES:
patent: 3601667 (1971-08-01), Desmond
patent: 3609471 (1971-09-01), Scace
patent: 3629672 (1971-12-01), Water
patent: 3706915 (1972-12-01), Lootens et al.
patent: 3729573 (1973-04-01), Dunn
patent: 3763403 (1973-10-01), Lootens
patent: 3783345 (1974-01-01), Taylor et al.
patent: 3783347 (1974-01-01), Vladik

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