Enhanced thermal path mechanical tolerance system

Details Enhanced thermal path mechanical tolerance system Enhanced thermal path mechanical tolerance system

2001-01-09

2002-06-18

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C361S710000, C361S718000, C361S719000, C257S706000, C257S717000, C257S718000, C257S719000, C165S080200, C165S080300, C165S185000

Reexamination Certificate

active

06407924

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a method and structure for maintaining a continuous thermally conductive path between a heat-generating module and a heatsink when both the module and the heatsink are under mechanical tension.
2. Related Art
An electronic package may comprise a chip-containing module that is coupled to a heatsink by an interfacing thermal pad such that both the module and the heatsink are under tension by a mechanical structure of the electronic package. If the tension deflects the module and the heatsink away from the thermal pad, then a thermally conductive path between the module and the heatsink will be severed and heat generated by the chip will not be effectively dissipated. As a consequence, the chip would overheat and have degraded performance or suffer damage.
For a chip subject to the mechanical structure of an electronic package, there is a need to effectively dissipate the heat that the chip generates.
SUMMARY OF THE INVENTION
The present invention provides a structure, comprising:
a heatsink under a first tension, said first tension causing a deflection of a surface of the heatsink, said surface of the heatsink having a first shape when the heatsink is not under said first tension and a second shape when the heatsink is under said first tension;
a module under a second tension, said second tension causing a deflection of a surface of the module, said surface of the module having a first shape when the module is not under said second tension and a second shape when the module is under said second tension; and
a thermally conductive pad having: a first surface in substantial thermal contact with the surface of the heatsink, and a second surface in substantial thermal contact with the surface of the module.
The present invention provides a method of forming a structure, comprising:
providing a module having a surface of a first shape, a heatsink having a surface of a first shape, and a thermally conductive pad;
disposing the thermally conductive pad between the module and the heatsink, wherein a first surface of the thermally conductive pad is in contact with the surface of the heatsink, and wherein a second surface of the thermally conductive pad is in contact with the surface of the module;
subjecting the heatsink to a first tension, said first tension deflecting the surface of the heatsink, said surface of the heatsink having a second shape under said first tension, said surface of the heatsink in substantial thermal contact with said first surface of the thermally conductive pad; and
subjecting the module to a second tension, said second tension deflecting the surface of the module, said surface of the module having a second shape under said second tension, said surface of the module in substantial thermal contact with said second surface of the thermally conductive pad.
For a chip subject to the mechanical structure of an electronic package, the present invention provides a method and structure for effectively dissipating the heat that the chip generates.


REFERENCES:
patent: 3619473 (1971-11-01), Meyerhoff et al.
patent: 3789248 (1974-01-01), Jaecklin et al.
patent: 4235283 (1980-11-01), Gupta
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 5528462 (1996-06-01), Pendse
patent: 5731955 (1998-03-01), Bartanen et al.
patent: 5735340 (1998-04-01), Mira et al.
patent: 5814536 (1998-09-01), Rostoker et al.
patent: 5869891 (1999-02-01), Rostoker et al.
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5926371 (1999-07-01), Dolbear
patent: 6081426 (2000-06-01), Takeda et al.
patent: 6088228 (2000-07-01), Petersen et al.

Affiliated with

Also associated with

Rating

Enhanced thermal path mechanical tolerance system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced thermal path mechanical tolerance system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced thermal path mechanical tolerance system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2914746