Enhanced tab package

Details Enhanced tab package Enhanced tab package

1988-01-15

1990-02-20

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 361306, 361400, 361406, 174 524, H01L 2314

Patent

active

049031139

ABSTRACT:
Improved tape automated bonding (TAB) packaging technology is disclosed having particular utility with semiconductor integrated circuit chips having high gate count and I/O requirements, utilizing a polymer layer of the package to support decoupling capacitor(s) mounted across power and ground leads connecting the chip and internal planes of a printed circuit board to which the TAB package is attached.

REFERENCES:
patent: H416 (1988-01-01), Covin
patent: 3887783 (1975-06-01), Comette et al.
patent: 4539472 (1985-09-01), Poetker et al.
patent: 4551746 (1985-11-01), Gilbert
patent: 4577214 (1986-03-01), Schaper
patent: 4587548 (1986-05-01), Grabbe
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4774635 (1988-09-01), Greenberg
I. Feinberg et al., "Low Inductance Decoupling Capacitor Connection", IBM Technical Disclosure Bulletin, vol. 28, No. 7, Dec., 1985, p. 2827.

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