Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-12-28
2004-09-21
Schuberg, Darren (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S688000
Reexamination Certificate
active
06795310
ABSTRACT:
BACKGROUND OF THE INVENTION
In electronic as well as non-electronic devices, enclosures are commonly used to house device components. These enclosures perform several functions including providing structural support to the device components, preventing the enclosed components from overheating, and vibration dampening. The enclosures are also referred to as housings. One example of an enclosure for an electronic device is a computer chassis. Typically, a computer includes a chassis that is generally a metallic frame. The chassis typically houses circuit boards, power supplies and wiring. The chassis typically includes four sidewalls and top and bottom elements. The sidewalls and the top and bottom elements are also referred to as chassis walls. Generally, at least one of the chassis walls comprises a removable cover such that the chassis components are easily accessible for replacement and repair purposes. The chassis walls are typically thick and rugged such that they provide a robust structural support for the enclosed components. The chassis walls are collectively referred to as the chassis skin.
The skin often encloses device components that can malfunction and cause device failure when they overheat. Some device components dissipate heat during their operation. They are referred to as heat sources. An example of the heat source includes the integrated chips that comprise the circuit boards installed in the computer chassis. The heat generated by the heat sources can damage not only the heat sources themselves but also the other components enclosed by the skin. To avoid device failure, therefore, the heat in the interior of the enclosure must be effectively managed. A common heat management technique includes designing a well-ventilated enclosure such that the heat can dissipate to the exterior of the enclosure. Another technique includes fabricating the enclosure from materials with high thermal conductivity. Still another technique includes installing a cooling fan inside the enclosure. Yet another effective heat management technique includes using a thermo-siphon device to absorb the heat from the interior of the enclosure and transfer it to a heat sink. The heat sink can include the air to the exterior of the enclosure or a cooler portion of the chassis away from the heat source. A well-known thermo-siphon device is the heat pipe.
A disadvantage of installing thermo-siphon devices in the interior of the enclosure is that they require additional space and thus increase the size of the enclosure. In the industries such as the notebook computer industry, the consumers are ever demanding a smaller and lighter chassis. The thermo-siphon devices are effective heat management tools and it is desirable to use them. There is a need in the art, therefore, for an enclosure design that houses the thermo-siphon devices without increasing the enclosure size.
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Blakely , Sokoloff, Taylor & Zafman LLP
Chang Yean-Hsi
Intel Corporation
Schuberg Darren
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