Enhanced polyisobutylene modified hot melt adhesive formulation

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C525S232000, C525S240000, C525S241000

Reexamination Certificate

active

06930148

ABSTRACT:
An improved hot melt adhesive includes a base polymer and a PIB modifier that is made up of a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position. The modifier may function to improve the loop tack and/or the peel adhesion of the hot melt adhesive.

REFERENCES:
patent: 3932563 (1976-01-01), Argurio et al.
patent: 4022728 (1977-05-01), Trotter et al.
patent: 4977206 (1990-12-01), Hwo et al.
patent: 5163976 (1992-11-01), Ravipati et al.
patent: 6096435 (2000-08-01), Maekawa et al.
patent: 6730739 (2004-05-01), Gipson
patent: 6777502 (2004-08-01), Ho et al.
patent: 6846893 (2005-01-01), Sherman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Enhanced polyisobutylene modified hot melt adhesive formulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced polyisobutylene modified hot melt adhesive formulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced polyisobutylene modified hot melt adhesive formulation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3466214

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.