Enhanced plating adhesion through the use of metallized fillers

Details Enhanced plating adhesion through the use of metallized fillers Enhanced plating adhesion through the use of metallized fillers

1996-07-01

1997-12-30

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating a substrate predominantly comprised of nonconductive...

205164, 205168, 205169, 205187, 205210, 216 7, 216 33, 216 35, 427307, C25D 554, C25D 556, B05D 304

Patent

active

057025843

ABSTRACT:
A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.

REFERENCES:
patent: 4349421 (1982-09-01), Khattab
patent: 5135773 (1992-08-01), Suzuki
Book: Author--Frederick A. Lowenheim. "Electroplating" published by McGraw Hill, copyright 1978, pp. 416 through 425.

Affiliated with

Also associated with

Rating

Enhanced plating adhesion through the use of metallized fillers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced plating adhesion through the use of metallized fillers , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced plating adhesion through the use of metallized fillers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-199039