Enhanced plasma etch process

Details Enhanced plasma etch process Enhanced plasma etch process

2007-02-20

2007-02-20

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C134S001100, C438S009000

Reexamination Certificate

active

10942995

ABSTRACT:
A method of operating a plasma etcher wherein gas is introduced into the etcher at a substantially higher rate than a previous standard rate for a desired etch selectivity, and the throttle valve's open value is set to a substantially greater open value than a previous standard open value for the desired etch selectivity. The method may also include introducing the gas at a lower pressure than the pressure of the previous standard pressure for a desired etch selectivity.

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