Enhanced mounting pads for printed circuit boards

Details Enhanced mounting pads for printed circuit boards Enhanced mounting pads for printed circuit boards

1998-06-08

2000-09-05

Sough, Hyung-Sub

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361772, 361777, 174260, 174261, 22818021, H05K 118, H05K 706

Patent

active

061152625

ABSTRACT:
There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

REFERENCES:
patent: 5243140 (1993-09-01), Bhatia et al.
patent: 5357060 (1994-10-01), Yamashita
patent: 5381307 (1995-01-01), Hertz et al.
patent: 5386087 (1995-01-01), Lee et al.
patent: 5453581 (1995-09-01), Liebman et al.
patent: 5670750 (1997-09-01), Lauffer et al.
patent: 5683788 (1997-11-01), Dugan et al.
patent: 5707714 (1998-01-01), Furutatsu et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 5961737 (1999-10-01), Glenn

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