Enhanced localized distributive capacitance for circuit boards

Details Enhanced localized distributive capacitance for circuit boards Enhanced localized distributive capacitance for circuit boards

2007-02-06

2011-11-15

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S272000, C361S303000, C361S313000, C361S782000, C174S260000, C174S262000, C438S250000, C257S532000, C257S780000

Reexamination Certificate

active

08059423

ABSTRACT:
A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a second conductive layer coupled to a second surface of the first dielectric layer, and (4) a localized distributive non-discrete capacitive element adjacent the first conductive layer, wherein the capacitive element occupies a region that approximately coincides with a location over which a device to be coupled to the capacitive element is to be mounted. The embedded, localized, non-discrete, and distributive capacitive element may provide device-specific capacitance to suppress voltage/current noise for a particular device.

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