Enhanced line stability by alloying of deposition

Details Enhanced line stability by alloying of deposition Enhanced line stability by alloying of deposition

1978-09-21

1979-06-26

Ozaki, G.

Metal treatment

Compositions

Heat treating

148178, 148188, H01L 21225

Patent

active

041592166

ABSTRACT:
A saturated or a supersaturated solution of the material of a solid body of semiconductor material in a layer of metal to be migrated by thermal gradient zone melting processing is utilized to achieve uniform penetration of fine lines (1 mil in width and less) and small droplets (less than 6 mils in diameter) in order to produce reliable semiconductor devices.

REFERENCES:
patent: 2813048 (1957-11-01), Pfann
patent: 3988766 (1976-10-01), Anthony et al.
patent: 4001047 (1977-01-01), Boah

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