Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-07-13
2000-10-10
Elms, Richard
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438118, 156382, H01L 2144, H01L 2148, H01L 2150
Patent
active
061301132
ABSTRACT:
An apparatus and method of making a void free interface between a heatspreader and pressure sensitive adhesive (PSA) by attaching them in an air free environment. The PSA is placed on a pedestal in a vacuum chamber assembly, then the heatspreader is placed on top of the PSA and the chamber is closed. The air is removed by a vacuum means, creating an air free environment. Once the desired vacuum is obtained and the air is removed, pressure is applied to the heatspreader and PSA, joining them together with a void free interface between them. After joining, the vacuum is released and the vacuum chamber assembly is opened so that the heatspreader with PSA attached can be removed. The heatspreader with PSA is now ready for use with a semiconductor package. Additionally, the heatspreader with PSA may be joined to the integrated circuit die of a semiconductor package in an air free environment by the same process (using vacuum and pressure) as describe above.
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Eslamy Mohammad
Jacobsen Larry L.
Elms Richard
LSI Logic Corporation
Wilson Christian D.
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