Enhanced integrated circuit package

Details Enhanced integrated circuit package Enhanced integrated circuit package

2011-07-05

2011-07-05

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S692000, C257SE23031

Reexamination Certificate

active

07973394

ABSTRACT:
A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.

REFERENCES:
patent: 6075281 (2000-06-01), Liao et al.
patent: 6849931 (2005-02-01), Nakae
patent: 2003/0003627 (2003-01-01), Yamaguchi et al.
patent: 2006/0113665 (2006-06-01), Lee et al.
patent: 2009/0014848 (2009-01-01), Ong Wai Lian et al.
patent: 1148637 (1997-04-01), None

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