Enhanced inductively coupled plasma reactor

Details Enhanced inductively coupled plasma reactor Enhanced inductively coupled plasma reactor

1999-03-22

2000-02-08

Diamond, Alan

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429808, 20429834, 20429816, 156345, 118723IR, 118723I, 427569, 216 67, 216 68, 216 70, C23C 1434

Patent

active

060224606

ABSTRACT:
An enhanced inductively coupled plasma reactor which comprises; a chamber; a power supply for providing radio-frequencies necessary to generate plasma within the chamber; an antenna for producing electric fields and magnetic fields with a radio-frequency power from the power supply to generate plasma within the chamber; Helmholtz coils for shaking the plasma with intermittent modulation of a weak magnetic field to increase the density of the plasma and decrease the electron temperature and enhance the uniformity of the plasma, the Helmholtz coils consisting of two coils which are symmetrically arranged with a common axis, winding around the chamber at an upper position and a lower position, respectively, the weak magnetic field being produced by providing a combination of a direct current and an alternating current to the Helmholtz coils; a wafer stage and support; a bias RF power supply for controlling ion energies, connected to the wafer stage; and a matching box for optimally controlling and transferring the power from the bias RF power supply. Axis-directed magnetic fields which vary with time are formed by the provision of the combination of the currents. When they are controlled in various cycles, the plasma can be effectively shaken and a resonant effect occurs, thereby increasing the ion density and decreasing the electron temperature.

REFERENCES:
patent: 5609774 (1997-03-01), Yamazaki et al.
patent: 5683548 (1997-11-01), Hartig et al.
patent: 5858259 (1999-01-01), Hirose et al.
patent: 5888414 (1999-03-01), Collins et al.
Jeong et al, "The Generation of Uniform High Density Plasma of Inductively Coupled Plasma Etcher Enhanced by Alternating Axial Magnetic Filed," Proceedings of IEEK Fall Conference '98, vol. 21, No. 2, pp. 589-592, Nov. 1998.
Jeong et al., Proceedings of IEEK Fall Conference '98, vol. 21, No. 2, hed by IEEK on Nov. 21, 1998.

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