Enhanced heat transfer structure with heat transfer members...

Details Enhanced heat transfer structure with heat transfer members... Enhanced heat transfer structure with heat transfer members...

2005-05-24

2005-05-24

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C165S104330, C165S170000, C165S185000, C257S715000, C257S722000, C257S714000, C361S700000, C361S696000, C361S703000

Reexamination Certificate

active

06898082

ABSTRACT:
A heat transfer structure includes a heat transfer module having a plurality of heat transfer members in the duct chamber with the density increased in the direction of the flow of the coolant and having a greatest density adjacent to the position of a heat source attached in thermal contact with the heat transfer module. The profile of the duct chamber is adjusted to the position of the heat source to increase the velocity of coolant directly under the heat source and to partially or completely block the coolant flow to the areas which do not need to be temperature adjusted. The heat transfer members may be formed as pin fins fabricated from springs compressed to a predetermined density in a direction perpendicular to the longitudinal axis of the spring (and/or in parallel to the longitudinal axis of the heat transfer module).

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