Enhanced heat sink attachment

Details Enhanced heat sink attachment Enhanced heat sink attachment

1998-11-04

1999-10-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 257719, 174 524, 165 803, H05K 720

Patent

active

059699507

ABSTRACT:
A slug or plate of copper or some other material having high heat conductivity is attached by an adhesive such as epoxy to a heat-emitting electrical component such as a chip, ASIC, microprocessor, or the like. A heat sink having a base and a plurality of fins upstanding from the base is attached to the slug or plate by screws, nuts or other, preferably detachable, means. The bottom of the base may be formed with a socket to receive the slug. The heat sink may be larger than the slug, thereby improving heat dissipation. When it is necessary to replace the component, the heat sink is detached from the slug and re-used.

REFERENCES:
patent: 5455457 (1995-10-01), Kurokawa
patent: 5473510 (1995-12-01), Dozier
patent: 5567986 (1996-10-01), Ishida
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5734554 (1998-03-01), Mitty et al.
patent: 5901039 (1999-05-01), Dehaine et al.

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