Enhanced heat exchanger

Details Enhanced heat exchanger Enhanced heat exchanger

2005-10-25

2005-10-25

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C361S704000, C257S712000, C257S715000, C174S015200, C165S080400, C165S104260, C165S185000

Reexamination Certificate

active

06958912

ABSTRACT:
According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.

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patent: 2002/0108743 (2002-08-01), Wirtz
Bhattacharya, A and Mahajan, R.L., “Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection”, ASME Journal of Electronic Packaging, vol. 124, (3), Sep. 2002, pp. 155-163.

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