Enhanced flow distributor for integrated circuit spot coolers

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165121, 361719, 415178, 4152131, H05K 720

Patent

active

056150849

ABSTRACT:
A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.

REFERENCES:
patent: 5297617 (1994-03-01), Herbert
patent: 5309983 (1994-05-01), Bailey
patent: 5377745 (1995-01-01), Hsieh
patent: 5475564 (1995-12-01), Chiou
patent: 5504650 (1996-04-01), Katsui

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Enhanced flow distributor for integrated circuit spot coolers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced flow distributor for integrated circuit spot coolers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced flow distributor for integrated circuit spot coolers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2208988

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.