Enhanced evaporator surface

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

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Details

165133, 122366, F28D 1502

Patent

active

048197190

ABSTRACT:
An enhanced capillary assisted evaporative surface for use in heat transfer devices; such as, 2-phase mounting plates, heat pipes and collectors. Rectangular grooves are cut in a conductive substrate and then plated by vapor deposition. The process produces a necked-down opening in the groove and a dendritic surface improving both capillary pumping and heat transfer coefficients.

REFERENCES:
patent: 4015659 (1977-04-01), Schladitz
patent: 4359086 (1982-11-01), Sanborn et al.

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