Enhanced ethylene methyl acrylate adhesive tie material for poly

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Weight per unit area specified

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428481, 428483, 428511, 428 342, 428 345, B32B 2710

Patent

active

059686472

ABSTRACT:
A laminate structure for containers produced using an unique extrudable adhesive tie layer which incorporates an antioxidant material. The antioxidant additive provides for the necessary and superior high temperature end-uses and stability of containers made therefrom.

REFERENCES:
patent: Re32270 (1986-10-01), Murray, Jr.
patent: 3904104 (1975-09-01), Kane
patent: 3939025 (1976-02-01), Kane
patent: 3967998 (1976-07-01), Kane
patent: 4387126 (1983-06-01), Rebholz
patent: 4391833 (1983-07-01), Self et al.
patent: 4455184 (1984-06-01), Thompson
patent: 4469258 (1984-09-01), Wright et al.
patent: 4573832 (1986-03-01), Zinner
patent: 4595611 (1986-06-01), Quick et al.
patent: 4698246 (1987-10-01), Gibbons et al.
patent: 4740377 (1988-04-01), Dawes et al.
patent: 4765999 (1988-08-01), Winter
patent: 4806398 (1989-02-01), Martin, Jr.
patent: 4900594 (1990-02-01), Quick et al.
patent: 4925684 (1990-05-01), Simon
patent: 5498452 (1996-03-01), Powers
patent: 5534575 (1996-07-01), Foster et al.
patent: 5772331 (1998-06-01), Irace et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Enhanced ethylene methyl acrylate adhesive tie material for poly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced ethylene methyl acrylate adhesive tie material for poly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced ethylene methyl acrylate adhesive tie material for poly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2053321

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.