Enhanced endpoint detection for wet etch process control

Details Enhanced endpoint detection for wet etch process control Enhanced endpoint detection for wet etch process control

2006-01-24

2006-01-24

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C156S345160, C156S345280

Reexamination Certificate

active

06989683

ABSTRACT:
Improved endpoint detection is obtained for wet etch and/or other chemical processes involving in situ measurement of bath impedance. The endpoint detection uses a measurement apparatus having a measurement circuit with a capacitor designed to alter the phase angle of the circuit. The capacitor is preferably a variable capacitor which is used to set the initial phase angle of the measurement circuit to about zero. The methods using the improved detection enable etch to be more precisely controlled even under conditions where noise would otherwise adversely impact determination of the endpoint.

REFERENCES:
patent: 3617459 (1971-11-01), Logan
patent: 5338390 (1994-08-01), Barbee et al.
patent: 5394084 (1995-02-01), Snyder
patent: 5445705 (1995-08-01), Barbee et al.
patent: 5451289 (1995-09-01), Barbee et al.
patent: 5456788 (1995-10-01), Barbee et al.
patent: 5480511 (1996-01-01), Barbee et al.
patent: 5489361 (1996-02-01), Barbee et al.
patent: 5500073 (1996-03-01), Barbee et al.
patent: 5501766 (1996-03-01), Barbee et al.
patent: 5516399 (1996-05-01), Balconi-Lamica et al.
patent: 5573623 (1996-11-01), Barbee et al.
patent: 5573624 (1996-11-01), Barbee et al.
patent: 5582746 (1996-12-01), Barbee et al.
patent: 5659492 (1997-08-01), Li et al.
patent: 5731697 (1998-03-01), Li et al.
patent: 5788801 (1998-08-01), Barbee et al.
patent: 6110287 (2000-08-01), Arai et al.
patent: 6293457 (2001-09-01), Srivastava et al.
Badih El-Kareh, Fundamentals of Semiconductor Processing Technologies 1995, Kluwer Academic Publishers.

Affiliated with

Also associated with

Rating

Enhanced endpoint detection for wet etch process control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced endpoint detection for wet etch process control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced endpoint detection for wet etch process control will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3527123