Enhanced electrochemical deposition (ECD) filling of high...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Agitating or moving electrolyte during coating

Reexamination Certificate

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C205S133000, C205S118000, C205S123000, C205S117000, C205S091000, C205S111000, C205S112000

Reexamination Certificate

active

06869515

ABSTRACT:
Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside narrow openings. The resulting inhibitor gradients facilitate void-free ECD filling of narrow openings with large aspect ratios. The inventive methods utilize vigorous electrolyte agitation at the field and top corners of the openings, while maintaining a relatively stagnant electrolyte inside the openings. Vigorous agitation is produced, for example, by high pressure jets flow and/or by mechanical means, such as brush (or pad, or wiper blade) wiping, or by a combination of jets and wiping brushes.

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