Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-06-20
2006-06-20
Purvis, Sue A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S295000, C156S297000, C156S307100, C156S325000, C174S259000, C438S119000, C257S783000
Reexamination Certificate
active
07063756
ABSTRACT:
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
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Farquhar Donald Seton
Klodowski Michael Joseph
Kohut Gerald Paul
Seman Andrew Michael
Hogg William N.
Purvis Sue A.
Samodovitz A. J.
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