Enhanced design and process for a conductive adhesive

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S295000, C156S297000, C156S307100, C156S325000, C174S259000, C438S119000, C257S783000

Reexamination Certificate

active

07063756

ABSTRACT:
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.

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