Enhanced defect elimination process for electronic assemblies vi

Details Enhanced defect elimination process for electronic assemblies vi Enhanced defect elimination process for electronic assemblies vi

1996-06-06

1998-04-28

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 3102

Patent

active

057449759

ABSTRACT:
A method for testing electronic assemblies having an electronic component affixed via solder or other such connections to a printed circuit board. The method includes combining, in order, three sequential stress test steps, into a single stress test for screening defects in the electronic assemblies. In particular, the test combines a thermal cycling stress test followed by a electrical burn-in stress test coupled with functional monitoring of the assembly, followed by a random vibration stress test coupled with functional monitoring of the assembly, each test is imposed with defined parameters upon the electronic assembly. The combination, order, and parameters of the sequential stress test steps provide a single test for electrical assemblies which substantially screens all such assemblies having systematic or random defects while imparting minimal reduction in useful life to the defect-free assemblies by virtue of the testing, thereby resulting in a high reliability product.

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Hobbs, G.K., "Highly Accelerated Life Tests--HALT", Hobbs Engineering Corporation, Westminster, CO, 1990. (Month Unavailable).
Hobbs, G.K., "Highly Accelerated Stress-Screens--HASS", Hobbs Engineering Corporation, Westminster, CO, Apr. 14, 1990.

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