Enhanced condensation heat transfer device and method

Heat exchange – With coated – roughened or polished surface

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428559, F28F 1318

Patent

active

041542940

ABSTRACT:
A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.

REFERENCES:
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patent: 3161478 (1964-12-01), Chessin
patent: 3653942 (1972-04-01), Boebel et al.
patent: 3689987 (1972-09-01), Teague
patent: 3751295 (1973-08-01), Blumenthal et al.
patent: 3990862 (1976-11-01), Dahl et al.
patent: 4018264 (1977-04-01), Albertson
Electrodeposition of Porous Metal, Faust et al., Paper Presented at the Fourth International Conference on Electrodeposition, London, 4/54.

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