Enhanced compliant probe card systems having improved planarity

Details Enhanced compliant probe card systems having improved planarity Enhanced compliant probe card systems having improved planarity

2008-03-25

2008-03-25

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S768000, C361S769000, C361S770000, C361S771000, C361S803000, C324S754090, C324S755090, C324S758010, C324S763010, C324S765010, C439S054000, C439S169000, C439S219000, C439S912000, C438S014000, C438S015000, C029S593000

Reexamination Certificate

active

10870095

ABSTRACT:
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.

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