Metal fusion bonding – Process – Plural joints
Patent
1990-07-27
1991-04-30
Heinrich, Sam
Metal fusion bonding
Process
Plural joints
228215, 361406, 174261, B23K 3102, H05K 334
Patent
active
050110667
ABSTRACT:
A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.
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patent: 4889275 (1989-12-01), Mullen, III et al.
P. M. Hall, "Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits", IEE Transactions: Components, Hybrids, and Manufacturing Technology, vol. 4, Dec. 1981, p. 403.
R. H. Minetti, "Solid Phase Bonding for Use in the Assembly of Micro-Electronics Circuits", ISHM, 1980, p. 126.
IBM Technical Disclosure Bulletin, "Via Interposer . . . ", vol. 30, No. 7, pp. 126, 127, Dec. 1987.
Heinrich Sam
Motorola Inc.
Nichols Daniel K.
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