Enhanced adhesion of substrate materials using ion-beam implanta

Details Enhanced adhesion of substrate materials using ion-beam implanta Enhanced adhesion of substrate materials using ion-beam implanta

1987-12-14

1989-07-18

Silverman, Stanley

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

1562722, 1562733, 20419211, 20419212, 20419231, 20415744, 228122, 228208, 427 37, 427 38, 427223, 427225, 427299, 427423, B05D 108

Patent

active

048492477

ABSTRACT:
A method is provided for improving the adhesion of a substrate material which does not form stable bonds to a bondable material by applying high energy bondable ions to the surface of the substrate to create an interface alloy layer and then adhering a bondable material to the surface of the substrate material. The high energy ions used may be meal ions. Before adhering, the thickness of the interface layer may be increased to form a layer utilizing conventional processes such as flame spray, plasma spray or D-gun spray. Additionally, the method may be used to join similar or dissimilar first and second substrate materials.

REFERENCES:
patent: 3674586 (1972-07-01), Rimkus
patent: 3872577 (1975-03-01), Kugler et al.
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4457972 (1984-07-01), Griffith et al.
patent: 4526624 (1985-07-01), Tombrello et al.
"Ion Beam Enhanced Adhesion"-T. A. Tombrello.
"Enhancement of Adhesion by MeV Ion Bombardment"-T. A. Tombrello.
"Ion Beam Enhanced Adhesion in the Electronics Stopping Region"-J. E. Griffith.
"Enhanced Adhesion From High Energy Ion Irradiation"-B. T. Werner et al.

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