Enhanced adhesion of H-resin derived silica to gold

Details Enhanced adhesion of H-resin derived silica to gold Enhanced adhesion of H-resin derived silica to gold

1995-06-26

1997-04-01

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 60, 264 61, 264 65, 29831, 29846, 29851, 427 58, 427 96, 427125, 4271262, 4271263, B32B 3126, B05D 512

Patent

active

056162022

ABSTRACT:
Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere.

REFERENCES:
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patent: 5039552 (1991-08-01), Riemer
patent: 5076876 (1991-12-01), Dietz
patent: 5387480 (1995-02-01), Haluska et al.
M.A. George et al., "Thermally induced changes in the resistance, microstructure, and adhesion of thin gold films on Si/SiO2 substrates," J. Vac. Sci. Technol. A 8(3), May/Jun. 1990, pp. 1491-1497.

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