Coating processes – Coating by vapor – gas – or smoke – Metal coating
Patent
1986-10-02
1988-01-19
Childs, Sadie L.
Coating processes
Coating by vapor, gas, or smoke
Metal coating
20419215, 427123, 427124, 427316, C23C 1606
Patent
active
047204010
ABSTRACT:
A technique is described for increasing the adhesion between metals and organic substrates, where the metals are those which normally only very weakly bond to the substrate. These metals include Ni, Cu, Al, Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd. The organic substrates include mylar, polyimides, polyesters, polyethylene, polystyrene, etc. Enhanced adhesion occurs when intermixing between the depositing metal atoms and the substrate is optimized to a depth less than about 1000 angstroms into the substrate. This occurs in a critical substrate temperature range of about (0.6-0.8) T.sub.c, where T.sub.c is the curing temperature of the substrate. The deposition rate of the metal atoms is chosen such that the arrival rate of the metal atoms at the surface of the substrate is comparable to or less than the rate of diffusion of metal atoms into the substrate. This provides optimum intermixing and maximum adhesion.
REFERENCES:
patent: 2884337 (1959-04-01), Homer et al.
patent: 2897091 (1959-07-01), Homer et al.
patent: 3881049 (1975-04-01), Brandt et al.
patent: 3914471 (1975-10-01), Cobb et al.
patent: 4015049 (1977-03-01), Yoda et al.
patent: 4152195 (1979-05-01), Bahrle et al.
patent: 4386116 (1983-05-01), Nair et al.
Hahn Peter O.
Ho Paul S. C.
Lefakis Harry
Rubloff Gary W.
Childs Sadie L.
International Business Machines - Corporation
Stanland Jackson E.
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