Engineering change facility on both major surfaces of chip modul

Details Engineering change facility on both major surfaces of chip modul Engineering change facility on both major surfaces of chip modul

1984-06-29

1985-10-08

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

361414, 361395, H05K 706

Patent

active

045464138

ABSTRACT:
A multiple chip module is provided with an engineering change (EC)/repair facility by means of delete lines located on both major surfaces of the module. In one embodiment, defective pin vias through the module are repaired by use of the delete lines on both major surfaces.

REFERENCES:
patent: 2963626 (1960-12-01), Du Val, Jr.
patent: 3509268 (1967-04-01), Schwarze et al.
patent: 3923359 (1975-12-01), Newsam
patent: 4254445 (1981-03-01), Ho
patent: 4371744 (1983-02-01), Badet et al.
patent: 4434321 (1984-02-01), Betts
IBM Technical Disclosure Bulletin, vol. 21, No. 3, Aug. 1978, p. 956, "Method for Making Engineering Changes on Printed-Circuit Boards" R. L. Weiss.
IBM Technical Disclosure Bulletin, vol. 24, No. 11A, Apr. 1982, "Shared EC Pad Design", pp. 5554-5556, E. Hubacher.
IBM Technical Disclosure Bulletin, vol. 21, No. 10, Mar. 1979, "Metallized Multilayer Ceramic Packages with Welded I/O Pins", G. C. Phillips, Jr., pp. 3974-3975.

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