Engineered self healing cementitious composites

Details Engineered self healing cementitious composites Engineered self healing cementitious composites

2008-04-17

2009-08-11

Edwards, N. (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Noninterengaged fiber-containing paper-free web or sheet...

C106S676000, C106S804000

Reexamination Certificate

active

07572501

ABSTRACT:
Cementitious composites engineered for self-healing, combining self-controlled tight crack width and extreme tensile ductility. Self-healing takes place automatically at cracked locations without external intervention. In the exemplary embodiment, fiber-reinforced cementitious composites with self-controlled tight crack width less than 50 μm and tensile ductility more than 2% are prepared. Self-healing in terms of mechanical and transport properties recovery of pre-damaged (by pre-cracking) composite is revealed in a variety of environmental exposures, include wetting and drying cycles, water permeation, and chloride submersion.

REFERENCES:
patent: 3466822 (1969-09-01), Piccard et al.
patent: 5433777 (1995-07-01), Sheppard
patent: 5564173 (1996-10-01), Sedman et al.
patent: 5575841 (1996-11-01), Dry
patent: 5660624 (1997-08-01), Dry
patent: 5788760 (1998-08-01), Li et al.
patent: 5989334 (1999-11-01), Dry
patent: 6261360 (2001-07-01), Dry
patent: 6809131 (2004-10-01), Li et al.
patent: 6969423 (2005-11-01), Li et al.
patent: 7445823 (2008-11-01), Tennison
patent: 2008/0107888 (2008-05-01), Dry
patent: 2008/0261027 (2008-10-01), Li et al.

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