Engagement probe having a grouping of projecting apexes for...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S757020

Reexamination Certificate

active

07026835

ABSTRACT:
An exemplary engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate is described. Constructions are disclosed for testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

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Moto'o Nakano, “A Probe for Testing Semiconductor Integrated Circuits and a Test Method Using Said Probe”, Mar. 25, 1991,Japanese Patent Office Disclosure No. Hei 3-69131, Filing No. Hei 1-205301, filing date Aug. 8, 1989.

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