Energy cured sealant composition

Details Energy cured sealant composition Energy cured sealant composition

1998-05-01

2000-10-24

Dawson, Robert

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Polymer derived only from ethylenically unsaturated monomer

428 417, 428 418, 525107, 525113, 525177, 525438, B32B 904

Patent

active

061363987

ABSTRACT:
A curable composition formed by mixing components comprising 10 to 70 weight percent of a curable epoxy resin; an effective amount of a curative for the epoxy resin; 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and 5 to 60 weight percent of a thermoplastic polyester resin, the parts by weight being based on the total weight of the resin in the composition.

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Database WPI Section Ch, Week 8830 Derwent Publications Ltd., London, GB; Class A18, AN 88-209011 XP002107710 & JP 63 144964 A (Osaka Kongo Seito KK), Jun. 17, 1988.
Database WPI Section Ch, Week 8145 Derwent Publications Ltd., London, GB; Class A21, AN 81-82591D XP002107711 & JP 56 122823 A (Nitto Electric Ind Co), Sep. 26, 1981.

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