Energy beam curable pressure sensitive adhesive composition and

Details Energy beam curable pressure sensitive adhesive composition and Energy beam curable pressure sensitive adhesive composition and

1997-04-18

1999-08-24

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

522112, 522182, 522126, 522129, 525227, 525228, 525230, 525108, 525125, 526931, C08L 3306, C08J 328

Patent

active

059425784

ABSTRACT:
An energy beam curable pressure sensitive adhesive composition is disclosed which comprises at least two energy beam curable copolymers having energy beam polymerizable groups in side chains thereof. This energy beam curable pressure sensitive adhesive composition has satisfactory adhesive strength before the irradiation with energy beam and can be cured by the irradiation with energy beam to a degree such that the amount of adhesive residue remaining on an adherend after peeling is extremely small. Further, the above composition ensures excellent expansibility at the expanding step and excellent recognition at the time of pickup. Still further, the above composition exhibits high work efficiency because of very low pickup strength at the bonding step, irrespective of the execution of the expanding step.

REFERENCES:
patent: 4185050 (1980-01-01), Lazear et al.
patent: 5098952 (1992-03-01), Blasko et al.
patent: 5202361 (1993-04-01), Zimmerman et al.
patent: 5244962 (1993-09-01), Plamthottam et al.
patent: 5302629 (1994-04-01), Berejka

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