Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...
Patent
1986-04-09
1987-08-04
Bleutge, John C.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Compositions to be polymerized by wave energy wherein said...
430280, 430921, 522170, 556 76, 556 80, 560255, 568 6, 568 13, 568 48, 568 49, 568 53, C08G 5972, C08G 5968, C08G 5962
Patent
active
046846719
DESCRIPTION:
BRIEF SUMMARY
FIELD OF INDUSTRIAL APPLICATION
The present invention relates to a composition capable of curing upon irradiation with an energy beam. More particularly, it relates to a resin composition which, when used as a coating material, readily cures and affords a cured coating film which gives off very little odor and bleeds very little decomposition products induced by irradiation.
PRIOR ART AND PROBLEMS THEREOF
Photopolymerizable polymeric materials have been under active study, particularly in the area of coating, from the standpoint of energy saving, space saving, and environmental pollution. However, the polymerization of such materials is based mainly on the radical polymerization of double bonds. For example, an epoxy resin, despite its good physical properties, does not readily undergo photopolymerization without the introduction of double bonds, which is accomplished in actual by the modification with an acrylic compound.
There is disclosed in U.S. Pat. No. 3,794,576 (Feb. 26, 1974) issued to Watt a new photopolymerizable epoxy resin composition having both good rheological properties and capability of rapid curing. This resin composition contains a photosensitive aromatic diazonium salt as a photopolymerization initiator. Upon exposure to light, the diazonium salt decomposes to liberate a Lewis acid which takes part in the polymerization of epoxy resin monomers. The aromatic diazonium salt, however, has a disadvantage of liberating nitrogen gas together with a Lewis acid upon photodecomposition. The nitrogen gas thus liberated causes foaming when the coating film of epoxy resin is thicker than 15 .mu.m. Therefore, it is not suitable for thick coating. Another disadvantage is that an epoxy resin composition containing the diazonium salt gradually cures even in the absence of light. Because of this poor storage stability, the diazonium salt is not suitable for one-pack compositions.
Extensive studies have been made to overcome the above-mentioned disadvantages of the diazonium salt initiator, and improvements were made in thick coating and storage stability. As the result, there were disclosed an aromatic sulfonium salt initiator and an aromatic iodonium salt initiator and a curable resin composition containing it in Japanese Patent Publication Nos. 14278/1977, 14277/1977, and 19581/1984 and Japanese Patent Laid-open No.53181/1979.
The composition containing an aromatic onium salt mentioned above is inferior in curability to the one containing a diazonium salt. Where the aromatic onium salt is an aromatic sulfonium salt, the composition containing it gives off an ill-smelling low-molecular weight compound when irradiated with an energy beam, with the result that the coating film has a foul smell. In order to eliminate this disadvantage, there was proposed a high-molecular weight aromatic sulfonium salt having a specific group in Japanese Patent Laid-open No. 55420/1981. However, it still is not satisfactory although it eliminates the disadvantage to some extent. Upon irradiation, it forms a low-molecular weight compound such as bisphenyl sulfide, which remains in the coating film, causing the film to smell.
It is an object of the present invention to provide an energy beam curable resin composition which is superior in curability and storage stability and, upon irradiation with an energy beam, liberates a very little amount of low-molecular weight compound such as diphenyl sulfide which is not desirable from the standpoint of odor, safety, and film properties.
MEANS TO SOLVE THE PROBLEMS
The object of the invention is achieved by an energy beam curable resin composition which comprises as essential constituents a cation-polymerizable substance and an effective amount of an onium salt of a Lewis acid represented by the following formula (I). ##STR3## [where X is a sulfonio group represented by the following formula (II). ##STR4## (where R.sub.1 -R.sub.10 are each a hydrogen atom, halogen atom, nitro group, alkoxy group, C.sub.1 -C.sub.18 aliphatic group, or C.sub.6 -C.sub.18 substituted or unsubstitu
REFERENCES:
patent: 2807648 (1957-09-01), Pitt
patent: 4026705 (1977-05-01), Crivello
patent: 4166478 (1979-07-01), Crivello
patent: 4173476 (1979-11-01), Smith
patent: 4193799 (1980-03-01), Crivello
patent: 4231951 (1980-11-01), Smith
patent: 4291114 (1981-09-01), Berggren
patent: 4374066 (1983-02-01), Crivello
patent: 4544732 (1985-10-01), Corley
Morio Kazuhiko
Murase Hisashi
Ohkawa Kazuo
Tsuchiya Hiroshi
Asahi Denka Kogyo K.K.
Bleutge John C.
Koeckert Arthur H.
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