Abrading – Precision device or process - or with condition responsive... – By optical sensor
Patent
1996-02-13
1997-07-01
Little, Willis
Abrading
Precision device or process - or with condition responsive...
By optical sensor
451285, 451288, 451289, 1566261, 1566451, B24B 3704
Patent
active
056430485
ABSTRACT:
The present invention is an endpoint regulator that controls the endpoint in chemical-mechanical planarization of a semiconductor wafer on a polishing pad. The endpoint regulator has a chuck with a mounting surface to which the wafer is attachable, and a spacer connected to the chuck around the periphery of the wafer. The spacer has a polish-stop face that extends axially downwardly with respect to the mounting surface; at least one of the polish-stop face or the wafer mounting surface is selectively spaceable with respect to the other to space the polish-stop face apart from the mounting surface by a distance equal to a desired post-planarization thickness of the wafer. In operation, the polish-stop face engages the polishing pad when the wafer is polished to the desired thickness to substantially prevent further planarization of the wafer. To selectively change the desired endpoint of a wafer, the spacer is either interchanged with a different spacer or adjusted to move the polish-stop face with respect to the mounting surface.
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patent: 5433650 (1995-07-01), Winebarger
Little Willis
Micro)n Technology, Inc.
Morgan Eileen P.
LandOfFree
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