Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2007-03-27
2007-03-27
Rose, Robert A. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S041000
Reexamination Certificate
active
11443788
ABSTRACT:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
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Crockett & Crockett
Crockett, Esq. K. David
Frechette, Esq. Marc J.
Rose Robert A.
Strasbaugh
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