Endpoint detection system for wafer polishing

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S041000

Reexamination Certificate

active

07052366

ABSTRACT:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

REFERENCES:
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5663637 (1997-09-01), Li et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5913713 (1999-06-01), Cheek et al.
patent: 5949927 (1999-09-01), Tang
patent: 5964643 (1999-10-01), Birang et al.
patent: 6012967 (2000-01-01), Satake et al.
patent: 6106662 (2000-08-01), Bibby et al.
patent: 6146242 (2000-11-01), Treur et al.
patent: 6190234 (2001-02-01), Swedek et al.

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