Endpoint detection system for wafer polishing

Details Endpoint detection system for wafer polishing Endpoint detection system for wafer polishing

2011-04-05

2011-04-05

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000, C451S041000

Reexamination Certificate

active

07918712

ABSTRACT:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

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