Endpoint detection for chemical mechanical polishing using frequ

Details Endpoint detection for chemical mechanical polishing using frequ Endpoint detection for chemical mechanical polishing using frequ

1996-03-19

1997-07-01

Oda, Christine K.

Electricity: measuring and testing

Determining nonelectric properties by measuring electric...

Semiconductors for nonelectrical property

324671, G01B 2700

Patent

active

056442211

ABSTRACT:
A method and apparatus for endpoint detection in removal of a film from a semiconductor wafer is provided, with a sensor for creating a signal responsive to the film removal process, a positive feedback amplifier coupled to the sensor, the positive feedback amplifier having a mode selector, and an analyzer coupled to the positive feedback amplifier.

REFERENCES:
patent: 3997835 (1976-12-01), Ando
patent: 4567435 (1986-01-01), Yamada
patent: 5212442 (1993-05-01), O'Toole

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