Endothermic cooler for electronic components

Details Endothermic cooler for electronic components Endothermic cooler for electronic components

1992-09-14

1993-11-02

Brown, David H.

Aeronautics and astronautics

Missile stabilization or trajectory control

Automatic guidance

62 4, 89 11, 102293, F42B 1501, F25B 500

Patent

active

052577554

ABSTRACT:
An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).

REFERENCES:
patent: 3067594 (1962-12-01), Bland et al.
patent: 3267857 (1966-08-01), Lindberg
patent: 3751166 (1973-08-01), Starkey et al.
patent: 4155521 (1979-05-01), Evans et al.
patent: 5077465 (1991-12-01), Wagner et al.
patent: 5077979 (1992-01-01), Skertic et al.
patent: 5187939 (1993-02-01), Skertic et al.

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