Endothermic cooler for electronic components

Details Endothermic cooler for electronic components Endothermic cooler for electronic components

1991-11-18

1993-02-09

Capossela, Ronald C.

Refrigeration

Chemical reaction or solids dissolving

622592, F25D 500

Patent

active

051844702

ABSTRACT:
An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).

REFERENCES:
patent: 2893213 (1959-07-01), Soloway
patent: 3067594 (1962-12-01), Bland et al.
patent: 3267856 (1966-08-01), Lindberg, Jr.
patent: 3267857 (1966-08-01), Lindberg, Jr.
patent: 4462224 (1984-07-01), Dunshee
patent: 4619678 (1986-10-01), Rubin

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