End terminations for capacitors

Metal working – Electric condenser making – Solid dielectric type

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Details

20419215, 20419217, 219121LJ, H01G 412, H01G 430

Patent

active

047410779

ABSTRACT:
A process for providing terminations at the ends of chips for multilayer capacitors such a MLC capacitors includes applying thin films of metallization at the opposite ends of each chip and over the surface of the chip between the ends, and thereafter removing a porton of the thin films of metallization material intermediate the ends, to provide a monolithic multilayer capacitor having proper metallized end terminations. Preferably, the thin films are applied to cover the entire surface of each chip by sputtering thin film material onto a batch of tumbling chips.

REFERENCES:
patent: 3992761 (1976-11-01), McElroy et al.
patent: 4584629 (1986-04-01), Garcia et al.
patent: 4613518 (1986-09-01), Ham et al.

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