End gaps of filled honeycomb

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S079000, C156S290000, C156S292000

Reexamination Certificate

active

07575650

ABSTRACT:
A sandwich panel includes a honeycomb core of a plurality of cells. A first skin is adhered to a first surface of the honeycomb core with an adhesive. A second skin is adhered to a second surface of the honeycomb core with the adhesive. The plurality of cells extend longitudinally between the first and second skins. The first and second skins adhere to the honeycomb core to form a sandwich panel having a surface area of at least 2.25 square feet. A foam fill is disposed within the cells of the honeycomb core. The foam fill and the honeycomb core define a first gap region proximate to the first skin and a second gap region proximate to the second skin.

REFERENCES:
patent: 3970324 (1976-07-01), Howat
patent: 4061812 (1977-12-01), Gilwee, Jr. et al.
patent: 4335174 (1982-06-01), Belko
patent: 4453367 (1984-06-01), Geyer et al.
patent: 4477012 (1984-10-01), Holland et al.
patent: 4557961 (1985-12-01), Gorges
patent: 5338594 (1994-08-01), Wang et al.
patent: 5569508 (1996-10-01), Cundiff
patent: 5776579 (1998-07-01), Jessup et al.
patent: 5897739 (1999-04-01), Forster et al.
patent: 6117518 (2000-09-01), Cawse et al.
patent: 6235370 (2001-05-01), Merrill et al.
patent: 6852192 (2005-02-01), Sato et al.
patent: 0 628 406 (1994-12-01), None
patent: 1 269 244 (1972-04-01), None
patent: 51-118215 (1976-09-01), None
patent: 57-108933 (1982-07-01), None
patent: 03-74936 (1991-07-01), None
patent: 07-233630 (1995-09-01), None
patent: 07-300913 (1995-11-01), None
patent: 09-295364 (1997-11-01), None
patent: 2000-141516 (2000-05-01), None
patent: 2003-181852 (2003-07-01), None
European Search Report issued for EP 04 25 1623, dated Oct. 28, 2004.
Japanese Office Action (in English language) issued for related JP Application 2004-085127, dated Feb. 26, 2008, 9 pages.
Japanese Office Action (in English language) issued for related Japanese Application No. 2004-85127; dated Aug. 26, 2008; 5 Pages.

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