Encoder measurement based on layer thickness

Details Encoder measurement based on layer thickness Encoder measurement based on layer thickness

2005-11-29

2005-11-29

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Position or displacement

Position transverse to viewing axis

C250S231130, C250S23700G

Reexamination Certificate

active

06970255

ABSTRACT:
An encoder includes a layer on the scale that has a thickness that varies as a function of position along the length of the scale. The position of the sensor head with respect to the scale may be determined by measuring the thickness of the layer or index of refraction, e.g., using a reflectometer, and converting the thickness to the lateral position. In one embodiment, the thickness of the layer is used to provide a rough position of the sensor head with respect to the scale and an alignment target that includes periodic patterns on both the sensor head and scale is used to provide a refined position.

REFERENCES:
patent: 4355903 (1982-10-01), Sandercock
patent: 5214492 (1993-05-01), LoBianco et al.
patent: 5216257 (1993-06-01), Brueck et al.
patent: 5241366 (1993-08-01), Bevis et al.
patent: 5307152 (1994-04-01), Boehnlein et al.
patent: 5499096 (1996-03-01), Tamiya
patent: 5559601 (1996-09-01), Gallatin et al.
patent: 5805290 (1998-09-01), Ausschnitt et al.
patent: 5969819 (1999-10-01), Wang
patent: 6077756 (2000-06-01), Lin et al.
patent: 6084712 (2000-07-01), Harding
patent: 6130750 (2000-10-01), Ausschnitt et al.
patent: 6313460 (2001-11-01), Haas et al.
patent: 6350984 (2002-02-01), Senda
patent: 6407396 (2002-06-01), Mih et al.
patent: 6429930 (2002-08-01), Littaue et al.
patent: 6458605 (2002-10-01), Stirton
patent: 2002/0135875 (2002-09-01), Niu et al.
patent: 2002/0158193 (2002-10-01), Sezginer et al.
patent: 2003/0002043 (2003-01-01), Abdulhalim et al.
patent: 2003/0042579 (2003-03-01), Schulz
patent: 2003/0043372 (2003-03-01), Schulz
patent: 2003/0043375 (2003-03-01), Opsal
patent: 2003/0044702 (2003-03-01), Schulz
patent: 2003/0160163 (2003-08-01), Wong et al.
patent: 2003/0169423 (2003-09-01), Finarov et al.
patent: 2003/0223630 (2003-12-01), Adel et al.
patent: 2004/0101983 (2004-05-01), Jones et al.
patent: 1-295116 (1989-11-01), None
patent: 2003-247864 (2003-09-01), None
patent: WO 01/84382 (2001-11-01), None
patent: WO 02/25723 (2002-03-01), None
patent: WO 02/065545 (2002-08-01), None
patent: WO 02/069390 (2002-09-01), None
patent: WO 02/084213 (2002-10-01), None
patent: WO 03/071471 (2003-08-01), None
D.C. Flanders & Henry I. Smith, A new interferometric alignment techniquea), Applied Physics Letters, vol. 31, No. 7, Oct. 1, 1977, pp. 426-428.
Bischoff, J. et al., “Light Diffraction Based Overlay Measurement”Proceedings of SPIE, vol. 4344 (2001) pp. 222-233.
Michaelis, A. et al., “Spectroscopic Anistropy Micro-Ellipsometry (SAME) for determiation of lateral and vertical dimensions of sub-micron lithographic structures” IEEE Catalog No. 99TH8453 (1999) pp. 131-134.
NanoWave:Technology/development tools, http://www.nanowave.com/technology—applications/tech—devtoolsPR.html, 2 pages, downloaded Apr. 9, 2002.
NanoWave:Technology/how it works, http://www.nanowave.com/technology—applications/tech—HIWPR.html, 3 pages, downloaded Apr. 9, 2002.
NanoWave:Technology/product design, http://www.nanowave.com/technology—applications/tech—designPR.html, 4 pages, downloaded Apr. 9, 2002.

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