Enclosure with improved knockouts

Details Enclosure with improved knockouts Enclosure with improved knockouts

2006-09-19

2006-09-19

Patel, Dhiru R. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

C174S053000, C174S057000, C174S058000, C439S535000

Reexamination Certificate

active

07109415

ABSTRACT:
Molded enclosures including integrally formed knockouts are described herein. In one implementation, a molded enclosure a wall having a wall thickness and a first knockout integrally formed in the wall. At least a portion of a periphery of the first knockout is defined by at least one attachment tab formed at a portion of the periphery of the first knockout and at least one space is formed at the periphery of the first knockout separating a portion of the wall from a portion of the first knockout, the at least one attachment tab joining the first knockout to the wall. Upon removal of the first knockout from the wall, a first opening is defined in the wall.

REFERENCES:
patent: 5444183 (1995-08-01), Gehrs et al.
patent: 6239368 (2001-05-01), Gretz
patent: 6242697 (2001-06-01), Gerken et al.
patent: 6765147 (2004-07-01), Weiss et al.
Hi-Tech Controls, Inc.; “Liquid Tight Industrial Enclosures & Accessories;” Jun. 2004; pp. 1 and 6; Hi-Tech Controls, Inc., Centennial, CO, U.S.A., no date.

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