Enclosure for the treatment, and particularly for the etching of

Details Enclosure for the treatment, and particularly for the etching of Enclosure for the treatment, and particularly for the etching of

1984-01-04

1985-01-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 156646, 204298, 204192E, H01L 2130, B44C 122, C03C 1500, C23F 100

Patent

active

044914962

ABSTRACT:
Enclosure for the treatment of substrates by the reactive plasma method, consisting in a known manner of an inlet and an outlet (12) for the circulation of a reactive gas at low pressure, a base supporting the substrate (10) to be treated being placed between two electrodes, one of which (3) is at the ground potential and the other (4) or radio-frequency electrode is brought to an alternative potential such as to create an electrical discharge in the enclosure. It is characterized in that the enclosure is metallic and lined by plasma torch spraying with a protective coating (2) of alumina (Al.sub.2 0.sub.3) of a thickness of about 300 micrometers.

REFERENCES:
patent: 4325778 (1982-04-01), Lepselter
patent: 4384918 (1983-05-01), Abe
patent: 4424096 (1984-01-01), Kumagai

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