Supports: cabinet structure – Knockdown or setup type – Skeletal frame
Patent
1989-11-13
1991-06-04
Falk, Joseph
Supports: cabinet structure
Knockdown or setup type
Skeletal frame
312296, A47B 8800
Patent
active
050208667
ABSTRACT:
An improved device for providing EMI/RFI shielding for a joint is disclosed comprising a compressible, resilient sealing element and a conductive shielding element bonded to the sealing element and positioned such that the shielding element provides a direct electrical contact across the joint. The disclosed invention further provides a cabinet which effectively utilizes such a device. The disclosed invention also includes an improved cabinet construction which minimizes the paths by which moisture and debris may enter the cabinet interior, while providing a cabinet which is transportable without violating the integrity of the cabinet structure.
REFERENCES:
patent: 846452 (1907-03-01), Byrne
patent: 2167525 (1939-07-01), Rosendale
patent: 3026367 (1962-03-01), Hartwell
patent: 3265415 (1966-08-01), Durnbaugh et al.
patent: 3583930 (1971-08-01), Ehrreich et al.
patent: 3736035 (1973-05-01), Brown et al.
patent: 3812316 (1974-05-01), Milburn
patent: 3890022 (1975-06-01), Moon
patent: 4105348 (1978-08-01), Anderson et al.
patent: 4281883 (1981-08-01), Zacky
patent: 4468067 (1984-08-01), Jenkins
patent: 4652695 (1987-03-01), Busby
patent: 4659869 (1987-04-01), Busby
patent: 4699270 (1987-10-01), Bohm
patent: 4705916 (1987-11-01), Wadhere et al.
patent: 4720606 (1988-01-01), Senn
patent: 4768845 (1988-09-01), Yeh
patent: 4782637 (1988-11-01), Eriksson et al.
patent: 4864076 (1989-09-01), Stickney
Falk Joseph
Gichner Systems Group, Inc.
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